Peel Test
Test Assembly
Sample Configuration
Data display
This engineering test was developed at Rutgers
for performance comparisons in direct bonded copper. As compared
to standard tensile tests: the peel sample preparation is simplified, testing
costs are reduced, and measurements are less flaw-sensitive. In addition
to obtaining average strength values, the effects of localized features
on the bond failure surface (blisters, delamination, etc.) can be seen
in and correlated to discontinuities in the peel strength vs. displacement
curve. More recently the method has been used to determine the strengths
of other types of bonds (active metal brazes, etc.). The sample geometry
shown below has been optimized for copper with respect to edge effects,
and plastic deformation of the foil. Although extraction
of pure stresses from the data is complicated the low cost and fast data
turn-around make the test attractive when applicable.
Test Assembly
Sample Configuration
Data Display
