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Presented at American Ceramic Society 101st Annual Meeting, Indianapolis, IN
Abstract:
Copper foils were direct (gas-metal eutectic) bonded to various zirconia substrates. The mean peel strength was
96 ± 18 N/cm (similar to 96% alumina prepared and tested equivalently). The large scatter in this data (as compared to alumina) is attributed to two distinct peel behaviors observed in testing which correspond to differences in evolved interface structure: low strength peels (~80 N/cm) were associated with regions containing large (~20mm ) particles which exhibited transgranular fracture; high strength peel behavior (~150 N/cm) was associated with areas covered by a high density of intersecting dendrites (the particles and dendrites are tentatively identified as Cu2O). Peel failure generated exact positive/negative surface replicas with failure following the Cu(a) phase intersection with either Cu2O or the ceramic (with the exception of the low strength case where Cu2O particles failed). X-ray diffraction studies of failure surfaces did not indicate interfacial compound formation at the metal/ceramic interface.
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The Interfacial
Structure and Substrate Additive Effect on
(UN-PUBLISHED)
Wan-Lan Chiang
Maiken Heim,
Victor A.
Greenhut,
Daniel J.
Shanefield,
Lois A.
Johnson
Abstract
Cu-Al2O3 direct bonds were made by the gas-metal eutectic method using oxygen in the firing atmosphere. Cu2O-Cu(a) eutectic lamellae as well as a reaction phase of CuAl2O4 were found at the bond interface. Surface analysis on both the ceramic and metal peel test fracture surfaces showed that nearly all Cu2O dendrites adhered to the Al2O3 surface and that all the metallic Cu(a) phase broke away resulting in two conjugate fracture surfaces which are perfect positive-negative replicas. Bond fracture consistently followed the Cu(a) interfaces with Cu2O and Al2O3 interface. Grain boundary glass constituents in the Al2O3 substrate were dissolved by molten Cu-O liquid during bonding and upon cooling formed small particles at the alumina surface grain boundaries. The presence of the oxide additive changed interfacial chemical reaction and may provide a mechanical anchoring effect.
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Influence
of surface treatment and supplier on
bond strength of Cu to AlN direct bonds
(UN-PUBLISHED)
Maiken Heim,
Wan-Lan Chiang
Victor A.
Greenhut,
Thomas R. Chapman
Abstract
Copper was bonded to five commercially available, electronic grade, Aluminum Nitride substrates using the gas-metal eutectic method. An optimum peel strength was observed at 66 ± 4 N/cm. The bonding mechanism, bond fracture behavior, process parameters and substrate chemistry effect were investigated. AlN substrates from different suppliers were compared with respect to bond strength and failure mechanism. Relationships between peel adhesion and substrate properties for as-received and surface polished substrates were determined.
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