Our Research       Direct Bond Copper/Gas-Metal Eutectic Active Metal Brazing Amalgam Joining Peel Adhesion Test         Direct Bond Copper/Gas-Metal Eutectic Invented by Burgess and Neugebauer at General Electric Company, this process uses a eutectic liquid formed from a metal and its surface oxide to form a bond to ceramics.  When the assembly is heated above the eutectic melting point but below the melting point of the pure metal, a thin layer of liquid is formed at the ceramic metal interface which wets both surfaces and promotes adhesion.  The process has been commerciallized by several companies and has captured the electronic ceramic substrate metallization market.
     Rutgers Contributions Basic Bonding Mechanisms Technology Transfer to Industry Effect of Al2O3 Composition In-situ Oxidation vs. Preoxidation Improved Peel Test and Testing Parameters Optimized AlN Surface Oxidation for Bonding Bond Comparison between  6  AlN Sources Thermal Shock/Cycling Damage Low-Cost Thermal Shock/Cycling Test Extension of Technology to Ni-O System Extension to Other Ceramics: Si3N4, SiC, ZrO2 Blister (Defect) Reduction for Industry Improved bonding through surface treatment      Active Metal Brazing Active metal brazing is commonly used in joining ceramics and metals for structural applications.  Here, the "active" metal, which is ordinarily alloyed in low concentration with other metals, has a strong affinity for the ceramic substrate anion.  When the braze is melted at the interface between a metal and a ceramic, the active metal will migrate to the ceramic surface where oxidation/reduction reactions take place to promote adhesion through the formation of an intermediate compound.
 
  Amalgam Joining An amalgam is defined as a system where a solid and a liquid react to form a solid product.  Often this reaction is accompanied by a volume expansion which is useful in the formation of compression fittings.  Although dental applications dominate this field, applications for other systems may soon be realized.